Semiconductor chip including penetrating electrodes, and semiconductor package including the semiconductor chip

A semiconductor package, comprising:

• a first semiconductor chip;
• and
• a second semiconductor chip stacked in a vertical direction with the first semiconductor chip,
• wherein each of the first and second semiconductor chips comprises:
• a body portion including a front surface and a back surface;
• penetrating electrodes penetrating the body portion;
• and
• back connection electrodes disposed over the back surface of the body portion and connected to the penetrating electrodes,
• wherein the penetrating electrodes include a power penetrating electrode for transmitting a power voltage and a ground penetrating electrode for transmitting a ground voltage,
• the back connection electrodes include a power back connection electrode connected to the power penetrating electrode and a ground back connection electrode connected to the ground penetrating electrode, and
• one power back connection electrode is connected with two or more power penetrating electrodes at the same time, and one ground back connection electrode is connected with two or more ground penetrating electrodes at the same time.