Lead frame, package structure comprising the same and method for manufacturing the package structure

A package structure, comprising:

• a die paddle;
• a semiconductor die disposed on the die paddle;
• a plurality of leads surrounding the die paddle, each of the leads including an inner lead portion and an outer lead portion connecting to the inner lead portion, wherein the inner lead portion is adjacent to and spaced apart from the die paddle, a bottom surface of the inner lead portion is higher than a bottom surface of the outer lead portion, the bottom surface of the inner lead portion comprises one or more supporting members disposed thereon and the one or more supporting members have a convex surface facing away from the inner lead portion;
• and
• an encapsulant covering the semiconductor die, the die paddle, the leads and the one or more supporting members.