Thermally conductive molding, production method for the same, structure, and multilayer film

A production method for a thermally conductive molding, the production method comprising:

• a step of preparing a first film that is disposed on a mold having a three-dimensional shape so as to conform to the three-dimensional shape, that has a shape corresponding to the three-dimensional shape, and that has a first layer and a second layer that is releasably adhered to the first layer on a surface opposite to the mold of the first layer;
• a step of disposing a curable composition including a thermally conductive material and a (meth)acrylic monomer on the first film;
• a step of disposing a second film on the curable composition and sandwiching the curable composition between the first film and the second film;
• a step of radically polymerizing the (meth)acrylic monomer in the curable composition to form a cured product of the curable composition between the first film and the second film;
• and
• a step of releasing the first layer from the second layer to obtain a thermally conductive molding including the second layer, the cured product, and the second film,
• wherein an oxygen transmissivity of the first film is less than 1000 ml/m2·24 h·atm, and a 50% elongation strength of the first film at 100° C. is 100 N/25 mm or less.