Heater elements for processor devices

A circuit board assembly comprising:

• a processor package comprising:
• a substrate having a first portion and a second portion;
• a central processing unit (CPU) mounted to the first portion of the substrate;
• and
• a heater element disposed on a surface of the second portion of the substrate.

A computing system comprising:

• a chassis;
• a circuit board assembly housed in the chassis, wherein the circuit board assembly comprises:
• a processor package comprising:
• a substrate having a first portion and a second portion;
• a processor device disposed on the first portion of the substrate;
• a heater element disposed on a surface of the second portion of the substrate;
• and
• a heat sink assembly disposed on the chassis to form a cover of the chassis such that the heat sink assembly is in contact with the processor device and not in contact with the heater element.