Semiconductor device
AssigneeChangxin Memory Technologies, Inc.
InventorShuliang Ning
Life of this patent
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Abstract
A semiconductor device is provided, including multiple memory chips and a temperature detection module. The temperature detection circuit includes: multiple temperature sensitive units, arranged on the memory chips to detect temperatures of the memory chips; and a processing unit. The multiple temperature sensitive units share the processing unit with each other. The processing unit is configured to process a signal of at least one of the temperature sensitive units. The processing unit includes a calibration value memory cell and a calibration unit. The calibration value memory cell is configured to store a calibration value corresponding to the temperature sensitive unit. The calibration unit is configured to calibrate the temperature sensitive unit according to the calibration value.
Claims20
A semiconductor device, comprising a plurality of memory chips and a temperature detection circuit, the temperature detection circuit comprising:
- a plurality of temperature sensitive elements, arranged on at least part of the memory chips to detect temperatures of at least part of the memory chips;
- and
- processor, wherein the plurality of temperature sensitive elements share the processor with each other, the processor is configured to process a signal of at least one of the temperature sensitive elements, the processor comprises a calibration value memory cell and a calibrator, the calibration value memory cell being configured to store a calibration value corresponding to the temperature sensitive element, and the calibrator being configured to calibrate the temperature sensitive element according to the calibration value.
Dependencies are inferred from the claim text.