Semiconductor packages and methods of forming the same

A semiconductor package, comprising:

• a circuit board structure, comprising outermost first conductive patterns and a first mask layer located aside and separated from the outermost first conductive patterns, wherein the outermost first conductive patterns and the first mask layer face a first side of an overlying first redistribution layer structure;
• a package structure, disposed over a second side opposite to the first side of the first redistribution layer structure;
• and
• first bonding elements, disposed between and electrically connected to the first redistribution layer structure and the outermost first conductive patterns of the circuit board structure.

A method of manufacturing a semiconductor package, comprising:

• forming a first redistribution layer structure over a carrier;
• providing at least one circuit board structure, wherein the circuit board structure comprises outermost first conductive patterns and a first mask layer at a first side thereof and outermost second conductive patterns at a second side opposite to the first side thereof, wherein the first mask layer has first opening patterns around the outermost first conductive patterns respectively, and at least some of the outermost first conductive patterns are spaced from the corresponding first opening patterns of the first mask layer;
• forming first bonding elements into the first opening patterns of the first mask layer;
• bonding the first side of the circuit board structure to a first side of the first redistribution layer structure through the first bonding elements;
• and
• forming an encapsulation layer to fill a space between the circuit board structure and the first redistribution layer structure.