Semiconductor package

A method of manufacturing semiconductor package, the method comprising:

• bonding an interposer substrate to a package substrate using a non-conductive film (NCF);
• providing a liquid resin along side surfaces of the interposer substrate such a portion of the liquid resin flows into a space between the package substrate and the interposer substrate;
• curing the liquid resin;
• and
• mounting a plurality of semiconductor chips on the interposer substrate, wherein the liquid resin has a filler mass different from a filler mass of the NCF.

A method of manufacturing semiconductor package, the method comprising:

• attaching a non-conductive film (NCF) onto a lower surface of a wafer including a plurality of semiconductor chips and scribe lane between the semiconductor chips;
• singulating the plurality of semiconductor chips and the NCF along the scribe lane such that a first semiconductor chip of the plurality of semiconductor chips and a corresponding portion of the NCF have same area and shape;
• bonding the first semiconductor chip to a package substrate using the corresponding portion of the NCF;
• and
• providing a side encapsulation material covering a side surface of the first semiconductor chip and having a filler mass greater than a filler mass of the NCF,
• wherein the side encapsulation material includes a portion interposed between the first semiconductor chip and the package substrate.