Power semiconductor module and manufacturing method for power semiconductor module

A manufacturing method for a power semiconductor module, comprising:

• preparing a package, the package including
• an external terminal electrode,
• a frame to which the external terminal electrode is attached, the frame being made of a first material,
• a heat sink plate supporting the frame and including a to-be-mounted region in the frame, the heat sink plate being made of a non-composite material containing copper with purity of 95.0 weight percentage or more, and
• a first adhesive layer bonding the frame and the heat sink plate to each other, the first adhesive layer being made of a second material different from the first material and having a first composition;
• mounting the power semiconductor element on the to-be-mounted region of the heat sink plate after the preparing of the package;
• and
• attaching a cover to the frame to constitute a sealing space sealing the power semiconductor element without gross leak,
• the attaching of the cover includes forming a second adhesive layer, the second adhesive layer bonding the frame and the cover to each other and having a second composition different from the first composition of the first adhesive layer.