Protective film forming agent for plasma dicing and method for manufacturing semiconductor chip
AssigneeTokyo Ohka Kogyo Co., Ltd.
InventorsTetsuro KINOSHITA, Teruhiro UEMATSU
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Abstract
A protective film forming agent for plasma dicing which can favorably form an opening (processed groove) of a desired shape by irradiation of a laser beam, at a desired position of the protective film, upon producing semiconductor chips by cutting a semiconductor substrate by plasma dicing, and a method for producing a semiconductor chip using this protective film forming agent. The protective film forming agent comprises a water-soluble resin, a light absorber, and a solvent, and a weight loss rate when the temperature is raised to 500° C. in thermogravimetry of the water-soluble resin is at least 80 weight %.
Claims10
A protective film forming agent for forming a protective film on a semiconductor wafer surface, comprising:
- a water-soluble resin (A);
- a light absorber (B) and a solvent (S),
- wherein a weight loss rate in a case of raising temperature to 500° C. in thermogravimetry of the water-soluble resin (A) is at least 80 weight %.
Dependencies are inferred from the claim text.