Back to results
US 2022/0020609 A1Published application
Substrate treating apparatus
AssigneeSemes Co., Ltd.
InventorsMiso PARK, Yong Hee LEE, Eui Sang LIM, Jinwoo JUNG
Life of this patent
Estimating the term…
Abstract
An apparatus for treating a substrate using a treating fluid in a supercritical state is provided. In a pressure increasing step of increasing a pressure in the treating space from a pressure lower than a critical pressure of the treating fluid to a treating pressure higher than the critical pressure, the apparatus controls a supply amount of the treating fluid supplied from a first supply port to control flow of the treating fluid supplied from the first supply port and then exhausted through an exhaust port.
Claims20
An apparatus for treating a substrate using a treating fluid in a supercritical state, the apparatus comprising:
- a chamber for providing a treating space for treating the substrate;
- a substrate support disposed within the chamber for supporting the substrate when the substrate is loaded into the chamber;
- a first supply port disposed in a lower wall of the chamber, wherein the first supply port is connected to a first supply line for supplying the treating fluid to a portion of the treating space located below the substrate;
- an exhaust port disposed in the lower wall of the chamber and spaced apart from the first supply port by a predetermined spacing, wherein the exhaust port is connected to an exhaust line for exhausting the treating fluid from the chamber;
- a branch line branching from the exhaust line and at a position of the exhaust line upstream of an exhaust valve installed at the exhaust line, wherein the branch line is always open;
- and
- a controller configured to control supply and exhaust of the treating fluid,
- wherein in a pressure increasing step of increasing a pressure in the treating space from a pressure lower than a critical pressure of the treating fluid to a treating pressure higher than the critical pressure, the controller is configured to control a supply amount of the treating fluid supplied from the first supply port to control flow of the treating fluid supplied from the first supply port and then exhausted through the exhaust port.
5 more elements
An apparatus for treating a substrate using a treating fluid in a supercritical state, the apparatus comprising:
- a chamber for providing a treating space for treating the substrate;
- a substrate support disposed within the chamber for supporting the substrate when the substrate is loaded into the chamber;
- a first supply port disposed in a lower wall of the chamber, wherein the first supply port is connected to a first supply line for supplying treating fluid to a portion of the treating space located below the substrate;
- a first exhaust port disposed in the lower wall of the chamber and spaced apart from the first supply port by a predetermined spacing, wherein the first exhaust port is connected to a first exhaust line for exhausting the treating fluid from the chamber;
- a second exhaust port connected to a second exhaust line for exhausting the treating fluid from the chamber, wherein the second exhaust port is always open;
- and
- a controller configured to control supply and exhaust of the treating fluid,
- wherein in a pressure increasing step of increasing a pressure in the treating space from a pressure lower than a critical pressure of the treating fluid to a treating pressure higher than the critical pressure, the controller is configured to control a supply amount of the treating fluid supplied from the first supply port to control flow of the treating fluid supplied from the first supply port and then exhausted through the second exhaust port.
5 more elements
An apparatus for treating a substrate using a treating fluid in a supercritical state, the apparatus comprising:
- a chamber for providing a treating space for treating the substrate;
- a substrate support disposed within the chamber for supporting the substrate when the substrate is loaded into the chamber;
- a first supply port connected to a first supply line for supplying treating fluid to a portion of the treating space located below the substrate;
- a second supply port connected to a second supply line for supplying the treating fluid to a portion of the treating space located above the substrate;
- an exhaust port connected to an exhaust line for exhausting the treating fluid from the chamber;
- a branch line branching from the exhaust line and at a position of the exhaust line upstream of an exhaust valve installed at the exhaust line, wherein the branch line is always open, wherein an orifice is installed in the branch line, wherein a diameter of the orifice is smaller than a diameter of the exhaust line;
- a blocking plate disposed between the first supply port and the substrate support for preventing the treating fluid from the first supply port from being sprayed directly onto the substrate;
- and
- a controller configured to control supply and exhaust of the treating fluid,
- wherein in a pressure increasing step of increasing a pressure in the treating space from a pressure lower than a critical pressure of the treating fluid to a treating pressure higher than the critical pressure, the controller is configured to control a supply amount of the treating fluid supplied from the first supply port to control flow of the treating fluid supplied from the first supply port and then exhausted through the exhaust port,
- wherein the controller is configured to control a supply flow rate of the treating fluid for a first period of the pressure increasing step and a supply flow rate of the treating fluid for a second period of the pressure increasing step subsequent to the first period to be different from each other,
- wherein the controller is configured to:
- control the supply flow rate of the treating fluid for the first period to a first flow rate;
- and
- control the supply flow rate of the treating fluid for the second period to a second flow rate greater than the first flow rate,
- wherein the first period is a period before the pressure in the inside of the treating space reaches the critical pressure of the treating fluid,
- wherein the controller is configured to:
- supply the treating fluid from the first supply port for a period before the pressure in the treating space reaches the critical pressure of the treating fluid in the pressure increasing step;
- supply the treating fluid in the supercritical state from the second supply port for a period after the pressure in the treating space has reached the critical pressure of the treating fluid;
- and
- after the treating of the substrate using the treating fluid in the supercritical state has been completed, open the exhaust valve to exhaust the treating fluid inside the treating space.
18 more elements
Dependencies are inferred from the claim text.