Semiconductor device and method for manufacturing the same

The method according to claim 1, wherein

• the second layer includes gold atoms and the second atoms, the second atoms being one of zinc, magnesium, and beryllium.

The method according to claim 1, wherein

• the first layer includes gold atoms and the first atoms, the first atoms being germanium.

The method according to claim 1, wherein

• the second atoms are distributed in the first and second layers by the heat-treating such that a first concentration peak of the second atoms is provided in a vicinity of an interface between the second layer and the third layer.

The method according to claim 4, wherein

• the distribution of the second atoms includes a second concentration peak in a vicinity of an interface between the n-type semiconductor layer and the first layer, the first concentration peak being higher than the second concentration peak.

The method according to claim 1, wherein

• the first atoms are distributed in the first and second layers by the heat-treating such that a third concentration peak of the first atoms is provided in a vicinity of an interface between the second layer and the third layer.

The method according to claim 6, wherein

• the distribution of the first atoms includes a fourth concentration peak in a vicinity of an interface between the n-type semiconductor layer and the first layer, the third concentration peak being higher than the fourth concentration peak.

The method according to claim 1, wherein the first layer is formed to have a thickness not less than 80 nanometers and not more than 500 nanometers.

The method according to claim 8, wherein the second layer is formed to have a thickness not less than 4 nanometers and not more than 200 nanometers.

The method according to claim 1, wherein the heat-treating is performed in a temperature range not less than 280° C. and not more than 400° C.

The method according to claim 1, wherein

• the stacked structure is formed on the semiconductor layers including the n-type semiconductor layer, and
• the semiconductor layers further includes a p-type semiconductor layer and a light emitting layer, the light emitting layer being provided between the n-type semiconductor layer and the p-type semiconductor layer, the n-type semiconductor layer being provided between the light emitting layer and the first layer.

The method according to claim 12, wherein

• the second atoms are distributed in the first and second layers by the heat-treating such that a first concentration peak of the second atoms is provided in a vicinity of an interface between the second layer and the third layer.