Ceramic electronic component and method of manufacturing the same

A method of manufacturing a ceramic electronic component, the method comprising:

• forming a ceramic multilayer structure having a substantially parallelepiped shape by alternately stacking ceramic dielectric green sheets and conductive pastes for internal electrode layers to form a multilayer portion in which the conductive pastes are alternately exposed to two edge faces opposite to each other of the multilayer portion, and disposing a cover layer on each of top and bottom faces of the multilayer portion in a first direction in which the ceramic dielectric green sheets and the conductive pastes are alternately stacked;
• applying a metal paste from each of two edge faces of the ceramic multilayer structure to at least one of side faces of the ceramic multilayer structure;
• and
• firing the metal pastes and the ceramic multilayer structure to form a multilayer chip and a pair of external electrodes formed from respective edge faces of the multilayer chip to at least one of side faces of the multilayer chip, the multilayer chip including a multilayer structure and a cover layer disposed on each of top and bottom faces of the multilayer structure in the first direction, the multilayer structure including dielectric layers and internal electrode layers that are alternately stacked so that the internal electrode layers are alternately exposed to the two edge faces of the multilayer structure,
• wherein the forming of the ceramic multilayer structure includes adjusting a thickness of the ceramic dielectric green sheet between adjacent conductive pastes for internal electrode layers so that a ratio of a thickness of the multilayer chip in the first direction to a width of the multilayer chip in a shorter side direction becomes 0.7 or less, and a thickness of a capacitance section where adjacent internal electrode layers connected to different external electrodes are opposite to each other in the first direction becomes equal to or greater than 2.2 times at least one of thicknesses of the cover layers in the first direction.

A method of manufacturing a ceramic electronic component, the method comprising:

• forming a ceramic multilayer structure having a substantially parallelepiped shape by alternately stacking ceramic dielectric green sheets and conductive pastes for internal electrode layers to form a multilayer portion in which the conductive pastes are alternately exposed to two edge faces opposite to each other of the multilayer portion, and disposing a cover layer on each of top and bottom faces of the multilayer portion in a first direction in which the ceramic dielectric green sheets and the conductive pastes are alternately stacked;
• firing the ceramic multilayer structure to form a multilayer chip including a multilayer structure and a cover layer disposed on each of top and bottom faces of the multilayer structure in the first direction, the multilayer structure including dielectric layers and internal electrode layers that are alternately stacked so that the internal electrode layers are alternately exposed to two edge faces opposite to each other of the multilayer chip;
• applying a metal paste from each of the two edge faces of the multilayer chip to at least one of side faces of the multilayer chip;
• and
• baking the metal pastes to form a pair of external electrodes,
• wherein the forming of the ceramic multilayer structure includes adjusting a thickness of the ceramic dielectric green sheet between adjacent conductive pastes for internal electrode layers so that a ratio of a thickness of the multilayer chip in the first direction to a width of the multilayer chip in a shorter side direction becomes 0.7 or less, and a thickness of a capacitance section where adjacent internal electrode layers connected to different external electrodes are opposite to each other in the first direction becomes equal to or greater than 2.2 times at least one of thicknesses of the cover layers in the first direction.