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US 2022/0019149 A1Published application
Structures and methods for use in photolithography
AssigneeASM IP Holding B.V.
InventorsDaniele Piumi, David Kurt de Roest
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Abstract
Methods of forming structures including a stress management layer for photolithography and structures including the stress management layer are disclosed. Further disclosed are systems for depositing a stress management layer. Exemplary methods include forming the stress management layer using one or more of plasma-enhanced cyclic (e.g., atomic layer) deposition and plasma-enhanced chemical vapor deposition.
Claims20
A method for forming a structure comprising:
- providing a substrate comprising a carbon-containing layer having a compressive stress to a reaction chamber;
- providing a precursor in the reaction chamber to deposit a stress management layer on the carbon-containing layer;
- wherein the stress management layer has a tensile stress.
A method of forming a structure, the method comprising the steps of:
- providing a substrate;
- forming a carbon-containing layer overlying a surface of the substrate, the carbon-containing layer having a compressive stress;
- forming a stress management layer overlying a surface of the carbon-containing layer, the stress management layer having a tensile stress;
- forming an underlayer overlying a surface of the stress management layer;
- and
- forming a photoresist layer overlying the underlayer, the photoresist layer comprising extreme ultraviolet (EUV) lithography photoresist.
3 more elements
Dependencies are inferred from the claim text.