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US 2022/0019128 A1Published application
MEMS Assembly Process Flow
OwnerMatthew Ng, Xiaolei Liu +1inventors
InventorsMATTHEW NG, Xiaolei Liu, Guiqin Wang
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Abstract
A method of producing a MEMS assembly includes: producing an OIS/IS subassembly, wherein the OIS/IS subassembly includes an optical image stabilizer and an image sensor; and coupling the OIS/IS subassembly to an AF subassembly to form an OIS/IS/AF assembly.
Claims23
A method of producing a MEMS assembly comprising:
- producing an OIS/IS subassembly, wherein the OIS/IS subassembly includes an optical image stabilizer and an image sensor;
- and
- coupling the OIS/IS subassembly to an AF subassembly to form an OIS/IS/AF assembly.
A method of producing a MEMS assembly comprising:
- producing an OIS/IS subassembly, wherein the OIS/IS subassembly includes an optical image stabilizer and an image sensor and producing an OIS/IS subassembly includes:
- dispensing an epoxy onto the optical image stabilizer,
- picking and placing the image sensor onto the optical image stabilizer,
- performing a thermal curing operation,
- wire bonding the optical image stabilizer and the image sensor;
- and
- inspecting the wire bonding;
- and
- coupling the OIS/IS subassembly to an AF subassembly to form an OIS/IS/AF assembly, wherein coupling the OIS/IS subassembly to an AF subassembly includes:
- dispensing an epoxy onto the AF subassembly, and
- picking and placing the OIS/IS subassembly onto the AF subassembly
8 more elements
A method of producing a MEMS assembly comprising:
- producing an OIS/IS subassembly, wherein the OIS/IS subassembly includes an optical image stabilizer and an image sensor;
- and
- coupling the OIS/IS subassembly to an AF subassembly to form an OIS/IS/AF assembly;
- coupling the OIS/IS/AF assembly to a printed circuit board to form a OIS/IS/AF PCB assembly;
- and
- coupling a housing to the OIS/IS/AF PCB assembly to form the MEMS assembly.
3 more elements
Dependencies are inferred from the claim text.