Three-dimensional heat dissipating device

A three-dimensional heat dissipating device, comprising:

• a vapor chamber comprising an inner cavity, a first capillary structure and at least one first joint, the first capillary structure disposed within the inner cavity, and the at least one first joint that is in communication with the inner cavity;
• at least one heat pipe provided with a pipe body, a second capillary structure and at least one second joint, the pipe body having a pipe space therein, the at least one second joint that is disposed at one end of the pipe body and connected to the at least one first joint, such that the pipe space is in communication with the inner cavity, the second capillary structure comprising a first section and at least one second section, the first section fixedly disposed within the pipe space of the pipe body and connected to the second section, and the second section curvedly extended from one end of the first section, disposed within the inner cavity, and connected to the first capillary structure;
• and
• a working fluid filled within the pipe space and the inner cavity for being guided to flow by the first capillary structure and the second capillary structure.