Composition for Low Dielectric Thermally Conductive Material and Low Dielectric Thermally Conductive Material

Abstract

A composition for a low dielectric thermally conductive material of the present technology contains: an acrylic resin composition containing an acrylic polymer formed by polymerizing one or two or more types of (meth)acrylates and one or two or more types of (meth)acrylates; crystalline silica having an average particle size of 20 μm or greater; a metal hydroxide having an average particle size of 15 μm or less; a polyfunctional monomer; and a polymerization initiator, wherein per 100 parts by mass of the acrylic resin composition, from 330 parts by mass to 440 parts by mass of the crystalline silica, from 90 parts by mass to 190 parts by mass of the metal hydroxide, from 0.01 parts by mass to 0.5 parts by mass of the polyfunctional monomer, and from 0.6 parts by mass to 1.3 parts by mass of the polymerization initiator are blended.

Dependencies are inferred from the claim text.