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US 2022/0017698 A1Published application
Thermosetting resin composition, film adhesive, prepreg, and production method thereof
AssigneeTeijin Limited
InventorsMiki HORIKAWA, Takaya SUZUKI, Hiroaki KUWAHARA
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Abstract
The present invention provides a thermosetting resin composition characterized by comprising a bismaleimide compound and a triazine compound having a diaminotriazine structure.
Claims15
A thermosetting resin composition comprising a bismaleimide compound and a triazine compound having a diaminotriazine structure.
A film adhesive comprising:
- a base material fiber;
- and a thermosetting resin composition,
- the thermosetting resin composition comprising:
- a bismaleimide compound;
- and a triazine compound having a diaminotriazine structure.
2 more elements
A prepreg comprising:
- a reinforcing fiber;
- and a thermosetting resin composition impregnated into a reinforcing fiber layer made of the reinforcing fiber,
- the thermosetting resin composition comprising:
- a bismaleimide compound and a triazine compound having a diaminotriazine structure.
1 more element
Dependencies are inferred from the claim text.