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US 2022/0017686 A1Published application
Epoxy resin photosensitive composition for optical waveguide, photosensitive film for optical waveguide, optical waveguide, and opto-electric hybrid board
AssigneeNitto Denko Corporation
InventorsKazuaki SUZUKI, Shinya OTA
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Abstract
To provide an optical waveguide having excellent adhesive properties with respect to a substrate, an epoxy resin photosensitive composition for an optical waveguide and a photosensitive film for an optical waveguide for fabricating the optical waveguide, and an opto-electric hybrid board including the optical waveguide.
Claims8
An epoxy resin photosensitive composition for an optical waveguide for forming an optical waveguide by being applied to a substrate and patterned by photo-processing comprising:
- a hydrogenated alicyclic epoxy resin represented by the following formula (1).
- (In the formula, R1 represents a hydrogen atom or a methyl group. R2 represents at least one divalent group selected from the group consisting of —CH2—, —C(CH3)H—, —C(CH3)2—, and —SO2—. A represents an arylene group having two or more branched alkyl groups having 4 or more carbon atoms as a substituent. B represents a divalent group represented by the following formula (2) or ether bonding. “n” represents a positive number.)
- (In the formula, R3 represents an alky ten e group which may have a substituent. “p” is 1 or 2. “m” is 0 or 1.)
Dependencies are inferred from the claim text.