Dielectric Film Forming Compositions

A dielectric film forming composition, comprising:

• a plurality of (meth)acrylate containing compounds, wherein the plurality of (meth)acrylate containing compounds comprise:
• at least one mono(meth)acrylate containing compound of structure (I),
• wherein R1 is a hydrogen atom, a C1-C3 alkyl group, a fully or partially halogen substituted C1-C3 alkyl group, or a halogen atom;
• R2 is a C2-C10 alkylene group, a C5-C20 cycloalkylene group, or a R4O group, wherein R4 is a linear or branched C2-C10 alkylene group or a C5-C20 cycloalkylene group;
• R3 is a substituted or unsubstituted linear, branched or cyclic C1-C10 alkyl group, a saturated or unsaturated C5-C25 alicyclic group, a C6-C18 aryl group, or a C7-C18 alkylaryl group;
• and n is 0 or 1;
• at least one di(meth)acrylate containing cross linker;
• and
• optionally at least one multi(meth)acrylate containing cross linker comprising at least 3 (meth)acrylate groups;
• at least one fully imidized polyimide polymer;
• and
• optionally, at least one solvent.