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US 2022/0017282 A1Published application
Package accommodating heat dissipation substrate and packing box
AssigneeDenka Company Limited
InventorsHiroaki OTA, Yosuke ISHIHARA, Daisuke GOTO
Life of this patent
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Abstract
A plurality of heat dissipation substrates stacked on each other, intermediate sheets disposed under a lowermost heat dissipation substrate, on an uppermost heat dissipation substrate, and between heat dissipation substrates adjacent to each other, a drying agent disposed over or under the plurality of heat dissipation substrates, and a bag that seals the plurality of heat dissipation substrates, the plurality of intermediate sheets, and the drying agent.
Claims11
A package comprising:
- a plurality of heat dissipation substrates stacked on each other;
- intermediate sheets disposed under a lowermost heat dissipation substrate, on an uppermost heat dissipation substrate, and between heat dissipation substrates adjacent to each other;
- a drying agent disposed over or under the plurality of heat dissipation substrates;
- and
- a bag that seals the plurality of heat dissipation substrates, the plurality of intermediate sheets, and the drying agent.
2 more elements
Dependencies are inferred from the claim text.