Covers for electronic devices
AssigneeHewlett-Packard Development Company, L.P.
InventorsChien-Ting Lin, Kuan-Ting Wu, Chi Hao Chang
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Abstract
The present disclosure is drawn to covers for electronic devices, coating sets for covers of electronic devices, and methods for making these covers. In one example, described herein is a cover for an electronic device comprising: a substrate; an adhesive layer on a surface of the substrate; a first thermally conductive layer on the adhesive layer; a first oxide layer on the first thermally conductive layer; an aluminum foil layer on the first oxide layer; a second oxide layer on the aluminum foil layer; and a second thermally conductive layer on the second oxide layer.
Claims15
A cover for an electronic device comprising:
- a substrate;
- an adhesive layer on a surface of the substrate;
- a first thermally conductive layer on the adhesive layer;
- a first oxide layer on the first thermally conductive layer;
- an aluminum foil layer on the first oxide layer;
- a second oxide layer on the aluminum foil layer;
- and
- a second thermally conductive layer on the second oxide layer.
The coating set of claim 9, wherein the first oxide layer and the second oxide layer each have a thickness of about 3 μm to about 15 μm.
A coating set for a cover of an electronic device comprising:
- a substrate;
- an adhesive layer on a surface of the substrate;
- a first thermally conductive layer on the adhesive layer;
- a first oxide layer on the first thermally conductive layer;
- an aluminum foil layer on the first oxide layer;
- a second oxide layer on the aluminum foil layer;
- a second thermally conductive layer on the second oxide layer;
- and
- a thermoplastic polymer layer on the second thermally conductive layer,
- wherein the first thermally conductive layer and the second thermally conductive layer are same or different and each comprise graphite, graphene, or a combination thereof.
A method of making an electronic device cover including a substrate, the method comprising:
- applying an adhesive layer on a surface of the substrate:
- applying a first thermally conductive layer on the adhesive layer;
- applying a first oxide layer on the first thermally conductive layer;
- applying an aluminum foil layer on the first oxide layer;
- applying a second oxide layer on the aluminum foil layer;
- applying a second thermally conductive layer on the second oxide layer;
- and
- applying a thermoplastic polymer layer on the second thermally conductive layer.
Dependencies are inferred from the claim text.