Method for slicing workpiece and wire saw
AssigneeShin-Etsu Handotai Co., Ltd.
InventorKenji KOBAYASHI
Life of this patent
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AssigneeShin-Etsu Handotai Co., Ltd.
InventorKenji KOBAYASHI
Estimating the term…
A method for slicing a workpiece includes feeding and slicing a workpiece held by a workpiece holder with a bonding member therebetween, while reciprocatively traveling a fixed abrasive grain wire wound around multiple grooved rollers to form a wire row, so that the workpiece is sliced at multiple positions simultaneously. The bonding member has a grindstone part. The method includes, after the workpiece is sliced and before it is drawn out from the wire row, a fixed-abrasive-grain removal step of pressing the wire against the grindstone to remove fixed abrasive grains from the wire while reciprocatively traveling. In the fixed-abrasive-grain removal step, the wire rate is 100 m/min. or less, and the load on each line of the wire is 30 g or more. The method prevents a sliced workpiece from catching a wire and from causing saw mark and wire break in drawing out the wire after slicing.
-6. (canceled)
A method for slicing a workpiece with a wire saw which includes a wire row formed by winding a fixed abrasive grain wire having abrasive grains secured to a surface thereof around a plurality of grooved rollers, the method comprising feeding a workpiece to the wire row for slicing the workpiece held by a workpiece holder with a bonding member bonded to the workpiece, while allowing the fixed abrasive grain wire to reciprocatively travel in an axial direction thereof, thereby slicing the workpiece at a plurality of positions aligned in an axial direction of the workpiece simultaneously,
A wire saw comprising:
Dependencies are inferred from the claim text.