Vacuum transfer device and substrate processing system
AssigneeTokyo Electron Limited
InventorsTatsuo HATANO, Naoki WATANABE
Life of this patent
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Abstract
A vacuum transfer device includes: a main body including an arm unit with an internal mechanical part therein and a vacuum seal, and configured to transfer a high temperature substrate in a vacuum; a substrate holder connected to the main body to hold the substrate; a heat transport member provided on a surface of the main body and made of a material having a higher thermal conductivity than that of a material constituting the main body in a creeping direction to transport heat transferred from the substrate to the substrate holder; and a heat radiator configured to dissipate heat transported by the heat transport member.
Claims18
A vacuum transfer device comprising:
- a main body including an arm with an internal mechanical part therein and a vacuum seal, and configured to transfer a high-temperature substrate in a vacuum;
- a substrate holder connected to the main body to hold the substrate;
- a heat transport plate provided on a surface of the main body, made of a material having a higher thermal conductivity than that of a material constituting the main body in a creeping direction, and configured to transport heat transferred from the substrate to the substrate holder;
- and
- a heat radiator configured to dissipate heat transported by the heat transport plate.
Dependencies are inferred from the claim text.