Lead-free solder alloy and solder joint part
AssigneeNihon Superior Co., Ltd.
InventorTetsuro NISHIMURA
Life of this patent
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Abstract
A lead-free solder alloy consisting essentially of: 32 mass % or more and 40 mass % or less of Bi; 0.1 mass % or more and 1.0 mass % or less of Sb; 0.1 mass % or more and 1.0 mass % or less of Cu; 0.001 parts by mass or more and 0.1 parts by mass or less of Ni; and a remainder of Sn with unavoidable impurities. The lead-free solder alloy further contains specific elements in amounts in predetermined ranges.
Claims20
A lead-free solder alloy consisting essentially of:
- 32 mass % or more and 40 mass % or less of Bi;
- 0.1 mass % or more and 1.0 mass % or less of Sb;
- 0.1 mass % or more and 1.0 mass % or less of Cu;
- 0.001 parts by mass or more and 0.1 parts by mass or less of Ni;
- and a remainder of Sn with unavoidable impurities.
A lead-free solder alloy consisting essentially of:
- 32 mass % or more and 40 mass % or less of Bi;
- 0.1 mass % or more and 1.0 mass % or less of Sb;
- 0.1 mass % or more and 1.0 mass % or less of Cu;
- 0.001 parts by mass or more and 0.1 parts by mass or less of Ni;
- 0.3 mass % or less of Ag;
- and a remainder of Sn with unavoidable impurities.
A lead-free solder alloy consisting essentially of:
- 32 mass % or more and 40 mass % or less of Bi;
- 0.1 mass % or more and 1.0 mass % or less of Sb;
- 0.1 mass % or more and 1.0 mass % or less of Cu;
- 0.001 parts by mass or more and 0.1 parts by mass or less of Ni;
- at least one selected from Fe and Co, wherein a content of each of Fe and Co is 0.001 mass % or more and 0.1 mass % or less;
- and a remainder of Sn with unavoidable impurities.
A lead-free solder alloy consisting essentially of:
- 32 mass % or more and 40 mass % or less of Bi;
- 0.1 mass % or more and 1.0 mass % or less of Sb;
- 0.1 mass % or more and 1.0 mass % or less of Cu;
- 0.001 parts by mass or more and 0.1 parts by mass or less of Ni;
- at least one selected from Ga, Mn, V, P, and Ge, wherein a content of each of Ga, Mn, V, P, and Ge is 0.001 mass % or more and 0.01 mass % or less;
- and a remainder of Sn with unavoidable impurities.
A lead-free solder alloy consisting essentially of:
- 32 mass % or more and 40 mass % or less of Bi;
- 0.1 mass % or more and 1.0 mass % or less of Sb;
- 0.1 mass % or more and 1.0 mass % or less of Cu;
- 0.001 parts by mass or more and 0.1 parts by mass or less of Ni;
- 0.3 mass % or less of Ag;
- at least one selected from Fe and Co, wherein a content of each of Fe and Co is 0.001 mass % or more and 0.1 mass % or less;
- and a remainder of Sn with unavoidable impurities.
A lead-free solder alloy consisting essentially of:
- 32 mass % or more and 40 mass % or less of Bi;
- 0.1 mass % or more and 1.0 mass % or less of Sb;
- 0.1 mass % or more and 1.0 mass % or less of Cu;
- 0.001 parts by mass or more and 0.1 parts by mass or less of Ni;
- 0.3 mass % or less of Ag;
- at least one selected from Ga, Mn, V, P, and Ge, wherein a content of each of Ga, Mn, V, P, and Ge is 0.001 mass % or more and 0.01 mass % or less;
- and a remainder of Sn with unavoidable impurities.
A lead-free solder alloy consisting essentially of:
- 32 mass % or more and 40 mass % or less of Bi;
- 0.1 mass % or more and 1.0 mass % or less of Sb;
- 0.1 mass % or more and 1.0 mass % or less of Cu;
- 0.001 parts by mass or more and 0.1 parts by mass or less of Ni;
- 0.3 mass % or less of Ag;
- at least one selected from Fe and Co, wherein a content of each of Fe and Co is 0.001 mass % or more and 0.1 mass % or less;
- at least one selected from Ga, Mn, V, P, and Ge, wherein a content of each of Ga, Mn, V, P, and Ge is 0.001 mass % or more and 0.01 mass % or less;
- and a remainder of Sn with unavoidable impurities.
A lead-free solder alloy consisting essentially of:
- 32 mass % or more and 40 mass % or less of Bi;
- 0.1 mass % or more and 1.0 mass % or less of Sb;
- 0.1 mass % or more and 1.0 mass % or less of Cu;
- 0.001 parts by mass or more and 0.1 parts by mass or less of Ni;
- at least one selected from Fe and Co, wherein a content of each of Fe and Co is 0.001 mass % or more and 0.1 mass % or less;
- at least one selected from Ga, Mn, V, P, and Ge, wherein a content of each of Ga, Mn, V, P, and Ge is 0.001 mass % or more and 0.01 mass % or less;
- and a remainder of Sn with unavoidable impurities.
Dependencies are inferred from the claim text.