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US 2022/0013889 A1Published application
Antenna module
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsJae Woong Choi, Jin Won Lee
Life of this patent
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Abstract
An antenna module includes a wiring structure including a plurality of insulating layers, a plurality of wiring layers, and a plurality of via layers; an antenna disposed on an upper surface of the wiring structure; a heat dissipation structure disposed around the antenna on the upper surface of the wiring structure; and an encapsulant disposed on the upper surface of the wiring structure and covering at least a portion of each of the antenna and the heat dissipation structure.
Claims20
An antenna module, comprising:
- a wiring structure including a plurality of insulating layers, a plurality of wiring layers, and a plurality of via layers;
- an antenna disposed on an upper surface of the wiring structure;
- a heat dissipation structure disposed around the antenna on the upper surface of the wiring structure;
- and
- an encapsulant disposed on the upper surface of the wiring structure and covering at least a portion of each of the antenna and the heat dissipation structure,
- wherein at least a portion of an uppermost wiring layer of the plurality of wiring layers is connected to the antenna through a first connection via of an uppermost via layer of the plurality of via layers, and
- wherein the first connection via penetrates at least a portion of the encapsulant.
4 more elements
An antenna module, comprising:
- a wiring structure;
- an antenna disposed on an upper surface of the wiring structure;
- a plurality of conductor lumps disposed on the upper surface of the wiring structure, spaced apart from the antenna, and surrounding at least a portion of a side surface of the antenna;
- and
- an encapsulant disposed on the upper surface of the wiring structure and covering the antenna and at least a portion of each of the plurality of conductor lumps.
2 more elements
An antenna module, comprising:
- an antenna having a connection pad disposed on a first surface thereof;
- an encapsulant disposed around the antenna and covering at least a portion of the first surface of the antenna, a second surface of the antenna opposing the first surface being exposed through the encapsulant;
- an insulating structure surrounding the encapsulant and having a through-hole therein, the insulating structure comprising a heat dissipation structure disposed around the antenna;
- a first connection via connecting the connection pad and penetrating the encapsulant;
- and
- a wiring structure disposed on the encapsulant and having a first surface facing the first surface of the antenna, the wiring structure comprising a first wiring layer disposed on the first surface of the wiring structure and connected to the first connection via and the heat dissipation structure.
3 more elements
Dependencies are inferred from the claim text.