Electronic Device and Manufacturing Method thereof
AssigneeShenzhen Royole Technologies Co., Ltd.
InventorsJiahao KANG, Ze YUAN, Haojun LUO, Wenbing HU, Shaowen WANG
Life of this patent
Estimating the term…
Abstract
The present disclosure discloses an electronic device, including backplane circuits, a plurality of conductive adhesive elements arranged on the backplane circuits at intervals, and a plurality of electronic components arranged on the plurality of conductive adhesive elements respectively. The backplane circuits are respectively electrically connected with the plurality of electronic components through the plurality of conductive adhesive elements. The present disclosure further discloses a manufacturing method used for manufacturing the above electronic device.
Claims17
An electronic device, comprising:
- a plurality of backplane circuits;
- a plurality of conductive adhesive elements arranged on the backplane circuits at intervals, respectively;
- and
- a plurality of electronic components arranged on the plurality of conductive adhesive elements respectively,
- wherein the backplane circuits are respectively electrically connected with the plurality of electronic components through the plurality of conductive adhesive elements.
A manufacturing method of an electronic device, comprising:
- forming a plurality of backplane circuits on a flexible substrate, wherein the backplane circuits have a plurality of connecting ends formed thereon respectively;
- forming conductive adhesive elements arranged at intervals on the backplane circuits respectively, wherein the conductive adhesive elements are anisotropic conductive materials;
- and
- arranging electronic components on the conductive adhesive elements respectively, wherein the electronic components have a plurality of conductive ends formed thereon respectively;
- the conductive ends and the connecting ends are arranged opposite to each other and press the conductive adhesive elements together so as to realize electrical connection between the backplane circuits and the electronic components.
Dependencies are inferred from the claim text.