Light emitting device

A light emitting device, comprises:

• a die-bonding substrate having a first surface and a second surface opposite to each other, and the first surface including a light emitting area and an electrode area;
• a light emitting semiconductor structure disposed on the light emitting area, and the light emitting semiconductor structure including a first-type semiconductor layer, a light emitting layer and a second-type semiconductor layer from bottom to top;
• a plurality of conductive pillars disposed in the light emitting semiconductor structure at intervals, and each of the conductive pillars disposed through the first-type semiconductor layer and the light emitting layer and not disposed through the second-type semiconductor layer, wherein each of the conductive pillars is in direct contact with the second-type semiconductor layer and electrically connected to the die-bonding substrate;
• an insulating layer having a first portion and a second portion, the first portion disposed between the first-type semiconductor layer and the die-bonding substrate, and the second portion electrically insulating the first-type semiconductor layer and the light emitting layer from the conductive pillars, wherein the first portion has a trench and a plurality of openings, and the trench is adjacent to an edge of the light emitting semiconductor structure, and a first width of each of the openings is smaller than a second width of each of the conductive pillars;
• a first electrode disposed on the electrode area and electrically connected to the first-type semiconductor layer, and the first electrode electrically insulated from each of the conductive pillars;
• and
• a second electrode disposed on the second surface and electrically connected to the conductive pillars.