Semiconductor device
AssigneeRohm Co., Ltd.
InventorsKazuki KAWASAKI, Yuki INOUE, Yusuke YOSHII
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AssigneeRohm Co., Ltd.
InventorsKazuki KAWASAKI, Yuki INOUE, Yusuke YOSHII
Estimating the term…
The present disclosure provides a semiconductor device capable of reducing wiring resistance by using a stripe wire. The semiconductor device includes: a source pad electrode formed on a second interlayer insulating layer; a plurality of source extraction electrodes extracted in a first direction from the source pad electrode; a drain pad electrode formed on the second interlayer insulating layer; and a plurality of drain extraction electrodes extracted in the first direction from the drain pad electrode. The source pad electrode and the plurality of source extraction electrodes are electrically connected to a plurality of source wires of stripe wire covered by the second interlayer insulating layer. The drain pad electrode and the plurality of drain extraction electrodes are electrically connected to a plurality of drain wires of the stripe wire. The plurality of drain extraction electrodes are engaged with the plurality of source extraction electrodes.
A semiconductor device, comprising:
A semiconductor device, comprising:
A semiconductor device, comprising:
Dependencies are inferred from the claim text.