An organic device comprising a substrate, a first conductive line and a second conductive line arranged above a main surface of the substrate, an interlayer insulating layer arranged above the first conductive line and the second conductive line, a first electrode arranged above the interlayer insulating layer, an organic layer arranged above the first electrode, and a second electrode arranged above the organic layer, wherein
- in a region, of the interlayer insulating layer, where the organic layer is arranged in an orthogonal projection with respect to the main surface, a first via hole, in which a first conductive member configured to electrically connect the first conductive line and the first electrode is arranged, and a second via hole, in which a second conductive member configured to electrically connect the second conductive line and the second electrode is arranged, are arranged,
- at least an upper portion of the first via hole is filled with the first conductive member,
- at least an upper portion of the second via hole includes a region which is not filled with the second conductive member,
- a side surface of the second via hole is covered by the second conductive member in the region which is not filled with the second conductive member in the second via hole,
- an inner wall, of the second conductive member, along the side surface of the second via hole includes a region without the organic layer, and
- the second electrode is in contact with the region without the organic layer in the inner wall, of the second conductive member, along the side surface of the second via hole.