Structure of 3d nand memory device and method of forming the same
AssigneeYangtze Memory Technologies Co., Ltd.
InventorsLi Hong Xiao, Li Xun Gu
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AssigneeYangtze Memory Technologies Co., Ltd.
InventorsLi Hong Xiao, Li Xun Gu
Estimating the term…
A method of forming a structure of 3D NAND memory device, including steps of forming a first stack layer on a substrate, forming a first channel hole extending through the first stack layer, forming a block layer on a surface of the first stack layer and the first channel hole, forming a sacrificial layer in the first channel hole, forming a second stack layer on the first stack layer and the sacrificial layer, performing a first etch process to form a second channel hole extending through the second stack layer and at least partially overlapping the first channel hole and to remove the sacrificial layer in the first channel hole, removing the block layer exposed from the second channel hole, and forming a function layer on a surface of the first channel hole and the second channel hole.
A method of forming a structure of 3D NAND memory device, comprising:
Dependencies are inferred from the claim text.