Semiconductor device including a circuit for transmitting a signal
AssigneeRenesas Electronics Corporation
InventorsToshihiko AKIBA, Kenji SAKATA, Nobuhiro KINOSHITA, Yosuke KATSURA
Life of this patent
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Abstract
Reliability of a semiconductor device is improved. The semiconductor device PKG1 includes a wiring substrate SUB1, a semiconductor chip CHP1 and a capacitor CDC mounted on the upper surface 2t of the wiring substrate SUB1, and a lid LD formed of a metallic plate covering the semiconductor chip CHP1 and the wiring substrate SUB1. The semiconductor chip CHP1 is bonded to the lid LD via a conductive adhesive layer, and the capacitor CDC, which is thicker than the thickness of the semiconductor chip CHP1, is disposed in the cut off portion 4d1 provided in the lid LD, and is exposed from the lid LD.
Claims15
A semiconductor device comprising:
- a wiring substrate having a first main surface and a second main opposite the first main surface, the first main surface having a central portion and a peripheral portion surrounding the central portion in plan view;
- a semiconductor chip having a front surface and a rear surface opposite the front surface, the semiconductor chip being mounted on the central portion of the first main surface of the wiring substrate;
- a first capacitor mounted on the peripheral portion of the first main surface of the wiring substrate;
- and
- a lid disposed over the first main surface of the wiring substrate such that the lid covers the semiconductor chip,
- the lid having a heat radiation portion and a flange portion surrounding the heat radiating portion,
- wherein in plan view, the first main surface of the wiring substrate has a rectangular shape comprised of:
- a first side extending in a first direction;
- a second side opposite the first side and extending in the first direction;
- a third side extending in a second direction perpendicular to the first direction;
- and
- a fourth side opposite the third side and extending in the second direction,
- wherein in plan view, the peripheral portion of the first main surface of the wiring substrate has:
- a first corner portion including a first corner defined by the first side and the third side;
- a second corner portion including a second corner defined by the third side and the second side;
- a third corner portion including a third corner defined by the second side and the fourth side;
- a fourth corner portion including a fourth corner defined by the fourth side and the first side;
- a first middle portion located between the first corner portion and the second corner portion, in the second direction;
- a second middle portion located between the second corner portion and the third corner portion, in the first direction;
- a third middle portion located between the third corner portion and the fourth corner portion, in the second direction;
- and
- a fourth middle portion located between the fourth corner portion and the first corner portion, in the first direction,
- wherein the flange portion of the lid is bonded to the wiring substrate via a first adhesive layer at each corner portion of the first main surface of the wiring substrate, and
- wherein the first capacitor is mounted on the first middle portion of the peripheral portion of the first main surface of the wiring substrate.
Dependencies are inferred from the claim text.