Back to results
US 2022/0013504 A1Published application
Wafer reconstitution and die-stitching
AssigneeApple Inc.
InventorsSanjay Dabral, Jun Zhai, Kwan-Yu Lai, Kunzhong Hu, Vidhya Ramachandran
Life of this patent
Estimating the term…
Abstract
Stitched die packaging techniques and structures are described in which reconstituted chips are formed using wafer reconstitution and die-stitching techniques. In an embodiment, a chip includes a reconstituted chip-level back end of the line (BEOL) build-up structure to connect a die set embedded in an inorganic gap fill material.
Claims20
A semiconductor structure comprising:
- a wiring layer;
- a die set on the wiring layer;
- and
- a silicon containing gap fill material on the wiring layer and laterally surrounding the die set.
1 more element
Dependencies are inferred from the claim text.