Package and manufacturing method thereof
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsSung-Hui Huang, Shang-Yun Hou, Kuan-Yu Huang
Life of this patent
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Abstract
A package includes a first die, a second die, a semiconductor frame, and a reinforcement structure. The first die has a first surface and a second surface opposite to the first surface. The first die includes grooves on the first surface. The second die and the semiconductor frame are disposed side by side over the first surface of the first die. The semiconductor frame has at least one notch exposing the grooves of the first die. The reinforcement structure is disposed on the second surface of the first die. The reinforcement structure includes a first portion aligned with the grooves.
Claims20
A package, comprising:
- a first die having a first surface and a second surface opposite to the first surface, wherein the first die comprises grooves on the first surface;
- a second die and a semiconductor frame disposed side by side over the first surface of the first die, wherein the semiconductor frame has at least one notch exposing the grooves of the first die;
- and
- a reinforcement structure disposed on the second surface of the first die, wherein the reinforcement structure comprises a first portion aligned with the grooves.
A package, comprising:
- a circuit substrate;
- an interposer disposed on the circuit substrate, wherein the interposer comprises grooves on a surface thereof opposite to the circuit substrate;
- a die and a semiconductor frame disposed side by side over the interposer opposite to the circuit substrate, wherein the semiconductor frame has at least one notch exposing the grooves of the interposer;
- a dam structure disposed on the interposer and surrounded by the semiconductor frame;
- conductive terminals sandwiched between the circuit substrate and the interposer;
- and
- a reinforcement structure located between the circuit substrate and the interposer, wherein the reinforcement structure comprises a trunk portion and branch portions extending out from the trunk portion.
A manufacturing method of a package, comprising:
- providing a wafer substrate having a first surface and a second surface opposite to the first surface, wherein the wafer substrate comprises grooves formed on the first surface;
- placing dies and a dummy die over the first surface of the wafer substrate, wherein the dummy die covers the grooves;
- laterally encapsulating the dies and the dummy die by an encapsulant;
- forming conductive terminals and a reinforcement structure on the second surface of the wafer substrate, wherein a portion of the reinforcement structure is aligned with the grooves;
- removing a portion of the dummy die to form a semiconductor frame having at least one opening exposing the grooves;
- and
- singulating the semiconductor frame, the wafer substrate, and the reinforcement structure to form singulated structures.
Dependencies are inferred from the claim text.