Wire bonding apparatus
AssigneeSamsung Electronics Co., Ltd.
InventorJONGEUN LEE
Life of this patent
Estimating the term…
Abstract
Disclosed is a wire bonding apparatus comprising a capillary, a wire clamp assembly, and a support. The wire clamp assembly includes a first member, a second member, a first contact member, and a second contact member. The first member includes a first body and a first tilting member. The second member includes a second body and a second tilting member. The first contact member is coupled to an inner surface of the first tilting member and extends in an extending direction of the first tilting member. The second contact member is coupled to an inner surface of the second tilting member and extends in an extending direction of the second tilting member. The second member is movable in the second direction.
Claims20
A wire bonding apparatus, comprising:
- a capillary that extrudes a wire;
- a wire clamp assembly disposed on the capillary;
- and
- a support disposed on the wire clamp assembly,
- wherein the wire clamp assembly includes:
- a first member;
- a second member spaced apart from the first member;
- a first contact member coupled to the first member;
- and
- a second contact member coupled to the second member and spaced apart from the first contact member,
- wherein the first member includes:
- a first body that extends in a first direction;
- and
- a first tilting member that extends at an acute angle relative to the first direction,
- wherein the second member includes:
- a second body that extends in the first direction and is spaced apart from the first body in a second direction;
- and
- a second tilting member that extends at the acute angle relative to the first direction and is spaced apart from the first tilting member,
- wherein the first contact member is coupled to an inner surface of the first tilting member and extends in an extending direction of the first tilting member,
- wherein the second contact member is coupled to an inner surface of the second tilting member and extends in an extending direction of the second tilting member, and
- wherein the second member is movable in the second direction.
A wire bonding apparatus, comprising:
- a capillary that extrudes a wire;
- a wire clamp assembly on the capillary;
- and
- a driver that drives the wire clamp assembly to move in the first direction and a second direction intersecting the first direction,
- wherein the wire clamp assembly includes:
- a first tilting member that extends along an acute angle relative to the first direction;
- a second tilting member that extends along the acute angle relative to the first direction and is spaced apart from the first tilting member;
- a first contact member coupled to an inner surface of the first tilting member;
- and
- a second contact member coupled to an inner surface of the second tilting member and spaced apart from the first contact member,
- wherein the first contact member extends in an extending direction of the first tilting member,
- wherein the second contact member extends in an extending direction of the second tilting member, and
- wherein the second tilting member is movable in the second direction.
A wire bonding apparatus, comprising:
- a capillary that extracts a wire;
- a wire clamp assembly on the capillary;
- a support on the wire clamp assembly, the support providing a through hole;
- a driver that drives the wire clamp assembly to move in a first direction and a second direction intersecting the first direction;
- and
- a slide rail that provides a slide hole,
- wherein the wire clamp assembly includes:
- a first member;
- a second member spaced apart from the first member;
- a first contact member coupled to the first member;
- and
- a second contact member coupled to the second member and spaced apart from the first contact member,
- wherein the second member is movable in the second direction,
- wherein the slide hole forms an arc shape whose center of curvature is located in the through hole, and
- wherein the wire clamp assembly is slidably coupled to the slide hole.
Dependencies are inferred from the claim text.