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US 2022/0013489 A1Published application
Display module and manufacturing method thereof
AssigneeSamsung Electronics Co., Ltd.
InventorsWon Choi, Sangkyun Im, Sanghoon Roh, Jihyeon Son, Joowhan Lee, Hyuntae Jang
Life of this patent
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Abstract
A display module and a method for manufacturing thereof are provided. The display module includes a substrate including a pad, a conduction film which is bonded to the substrate including the pad, wherein at least one of a surface of the conduction film and an inner portion of the conduction film is black color treated, and a display device mounted on the pad to which the conduction film is bonded.
Claims20
A display module, comprising:
- a substrate comprising a pad;
- a conduction film bonded to the substrate, wherein at least one of a surface of the conduction film and an inner portion of the conduction film is black color treated;
- and
- a display device mounted on the pad to which the conduction film is bonded.
1 more element
A method of manufacturing a display module, the method comprising:
- bonding a conduction film to a substrate that comprises a pad, wherein at least one of a surface of the conduction film and an inner portion of the conduction film is black color treated;
- and
- mounting a display device on the pad to which the conduction film is bonded.
A printed circuit board comprising:
- a pad configured to be adhered to an electronic component;
- and
- a conduction film bonded to the pad,
- wherein at least one of a surface of the conduction film and an inner portion of the conduction film is black color treated.
1 more element
Dependencies are inferred from the claim text.