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US 2022/0013484 A1Published application
Chip, circuit board and electronic device
AssigneeBeijing Xiaomi Mobile Software Co., Ltd.
InventorsJinfu ZHANG, Yunjun HUA
Life of this patent
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Abstract
The present disclosure relates to a chip, a circuit board and an electronic device. The chip includes a chip substrate and a plurality of pads arrayed on the chip substrate. At least one of the plurality of pads on the chip is a polygonal pad.
Claims23
A chip, comprising:
- a chip substrate;
- and
- a plurality of pads provided on the chip substrate,
- wherein the plurality of pads are arrayed on the chip substrate;
- and
- at least one of the plurality of pads is a polygonal pad.
3 more elements
A circuit board, comprising:
- a circuit board substrate;
- and
- a plurality of pads provided on the circuit board substrate;
- wherein the plurality of pads are arrayed on the circuit board substrate;
- and
- at least one of the plurality of pads is a polygonal pad.
3 more elements
An electronic device, comprising:
- a chip;
- and
- a circuit board,
- wherein the chip comprises:
- a chip substrate;
- and
- a first plurality of pads provided on the chip substrate, wherein the first plurality of pads are arrayed on the chip substrate, and at least one of the first plurality of pads is a polygonal pad;
- and
- wherein the circuit board comprises:
- a circuit board substrate;
- and
- a second plurality of pads provided on the circuit board substrate, wherein the second plurality of pads are arrayed on the circuit board substrate, and at least one of the second plurality of pads is a polygonal pad.
9 more elements
Dependencies are inferred from the claim text.