Passivation Structure With Increased Thickness for Metal Pads

A structure comprising:

• an electrical connector;
• a plurality of dielectric layers covering at least one edge portion of the electrical connector, wherein the plurality of dielectric layers comprise:
• a first dielectric layer;
• a second dielectric layer overlying or underlying the first dielectric layer;
• and
• a first isolation layer over both of the first dielectric layer and the second dielectric layer;
• and
• a second isolation layer overlapping the electrical connector, wherein the second isolation layer comprises a sidewall contacting sidewalls of the first dielectric layer, the second dielectric layer, and the first isolation layer, and wherein the second isolation layer comprises:
• a first portion overlapped by the first isolation layer, with the first portion having a first width;
• and
• a second portion overlapped by the first isolation layer, with the second portion having a second width different from the first width.

A structure comprising:

• a metal pad;
• a plurality of oxide layers covering at least one edge portion of the metal pad;
• a first nitride layer overlapping the plurality of oxide layers, wherein edges of the plurality of oxide layers are laterally recessed from respective edges of the first nitride layer in lateral directions toward edges of the metal pad;
• and
• a second nitride layer in an opening in the plurality of oxide layers and the first nitride layer, wherein the second nitride layer is in physical contact with both of the metal pad and the first nitride layer.