Package and method of fabricating the same
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsMing-Fa Chen, Chao-Wen Shih, Tzuan-Horng Liu, Jen-Li Hu
Life of this patent
Estimating the term…
Abstract
Provided is packages and methods of fabricating a package and. The method includes bonding a first device die with a second device die. The second device die is over the first device die. A bonding structure is formed in a combined structure including the first and the second device dies. A component is formed in the bonding structure. The component includes a passive device or a transmission line. The method further includes forming a first and a second electrical connectors electrically coupling to a first end and a second end of the component.
Claims20
A method of fabricating a package, comprising:
- providing a first die, wherein the first die comprises a first part of a component;
- providing a first die, wherein the second die comprises a second part of the component;
- bonding a first device die with a second device die, wherein the second device die is over the first device die, thereby forming a bonding structure in a combined structure comprising the first device die and the second device die, and forming the component in the bonding structure, wherein the component comprises at least one of a passive device and a transmission line;
- and
- forming a first electrical connector and a second electrical connector electrically coupling to a first end and a second end of the component.
A method of fabricating a package, comprising:
- providing a first device die, wherein the first device die comprises a first bonding layer, the first bonding layer comprises a first insulating layer, a first part of a component and a plurality of first bond pads, and the plurality of the first bond pads and the first part of the component are embedded in the first insulating layer through a first damascene process;
- providing a second device die on the first device die, wherein the second device die comprises a second bonding layer, the second bonding layer comprises a second insulating layer, a second part of the component and a plurality of second bond pads, and the plurality of the second bond pads and the second part of the component are embedded in the second insulating layer through a second damascene process;
- bonding the first device die with the second device die through hybrid bonding the first bonding layer and the second bonding layer, thereby forming the component, wherein the component comprises a passive device or a transmission line;
- and
- forming a first electrical connector and a second electrical connector electrically coupling to a first end and a second end of the component.
A package comprising:
- a first device die;
- a second device die over and bonded to the first device die through a bonding structure thereof;
- a component in the bonding structure, wherein the component comprises a passive device or a transmission line;
- and
- a first electrical connector and a second electrical connector electrically coupling to a first terminal and a second terminal of the component,
- wherein the component comprises:
- a first part in the first die;
- and
- a second part in the second die.
Dependencies are inferred from the claim text.