Package comprising passive device configured as electromagnetic interference shield

An apparatus comprising:

• a substrate comprising a first surface and a second surface opposite the first surface;
• at least one electrical component coupled to the first surface of the substrate;
• and
• means for electromagnetic interference (EMI) shielding through at least one passive device,
• wherein the at least one passive device is coupled to the first surface of the substrate, and
• wherein the at least one passive device is located laterally to the at least one electrical component.

A method for fabricating a package, comprising:

• providing a substrate comprising a first surface, an opposing second surface, and a plurality of interconnects;
• coupling at least one electrical component to one or more interconnects of the plurality of interconnects of the substrate;
• and
• coupling at least one passive device to one or more interconnects of the plurality of interconnects of the substrate, wherein the at least one passive device is configured to form at least a portion of an electromagnetic interference (EMI) shield.