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US 2022/0013469 A1Published application
Semiconductor device and method for fabricating the same
AssigneeSK hynix Inc.
InventorHyun Chul SEO
Life of this patent
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Abstract
A semiconductor device includes: a semiconductor wafer with a chip region and an edge region and with an identification mark formed on one surface of the semiconductor wafer in the edge region; conductive connectors formed on the one surface of the semiconductor wafer in the chip region; and dummy conductive connectors formed on the one surface of the semiconductor wafer in the edge region, wherein the dummy conductive connectors do not overlap with the identification mark.
Claims11
A semiconductor device comprising:
- a semiconductor wafer with a chip region and an edge region and with an identification mark formed on one surface of the semiconductor wafer in the edge region;
- conductive connectors formed on the one surface of the semiconductor wafer in the chip region;
- and
- dummy conductive connectors formed on the one surface of the semiconductor wafer in the edge region,
- wherein the dummy conductive connectors do not overlap with the identification mark.
2 more elements
A semiconductor device comprising:
- a semiconductor wafer with a chip region and an edge region and with an identification mark formed on one surface of the semiconductor wafer in the edge region;
- conductive connectors formed on the one surface of the semiconductor wafer in the chip region;
- and
- dummy conductive connectors formed on the one surface of the semiconductor wafer in the edge region,
- wherein the dummy conductive connectors avoid overlapping with the identification mark.
2 more elements
Dependencies are inferred from the claim text.