Assemblies having Conductive Interconnects which are Laterally and Vertically Offset Relative to One Another

An integrated assembly, comprising:

• a base comprising logic circuitry;
• a first deck over the base;
• the first deck comprising first memory circuitry and a first conductive line associated with the first memory circuitry;
• a second deck over the first deck;
• the second deck comprising second memory circuitry and a second conductive line associated with the second memory circuitry;
• a first conductive interconnect extending between the base and the first deck;
• the first conductive line being coupled with the logic circuitry through at least the first conductive interconnect;
• a second conductive interconnect extending between the first deck and the second deck;
• the second conductive line being coupled with the logic circuitry through a path which includes the first and second conductive interconnects, and a region of the first conductive line;
• and
• wherein the first conductive interconnect is laterally offset from the second conductive interconnect.

An integrated assembly, comprising:

• a base comprising first circuitry;
• memory decks over the base;
• each of the memory decks comprising a sense/access line coupled with the first circuitry;
• the memory decks being vertically spaced from one another by gaps;
• the gaps alternating in a vertical direction between first gaps and second gaps;
• a gap between the base and a bottommost of the memory decks being one of the first gaps;
• and
• overlapping conductive paths from the sense/access lines to the first circuitry;
• the conductive paths including first conductive interconnects within the first gaps and second conductive interconnects within the second gaps;
• the first and second conductive interconnects being laterally offset relative to one another.