Wiring substrate and method for manufacturing wiring substrate

A method of manufacturing a wiring substrate;

• comprising:
• preparing a laminate comprising a conductor layer and a resin insulating layer laminated on the conductor layer;
• forming a hole in the resin insulating layer such that the hole is connected to the conductor layer;
• forming a plating resist on the resin insulating layer such that the plating resist has a pad opening formed therein and connected to the hole;
• filling the hole and the pad opening with a conductor such that a via conductor is formed in the hole and a conductor pad is formed in the pad opening;
• forming a resist layer on the conductor pad such that the resist layer has a post opening formed therein and connected to the conductor pad;
• and
• filling the post opening with a conductor such that a metal post is formed in the post opening,
• wherein the forming of the plating resist includes forming the pad opening such that the pad opening has a center that is shifted from a center of the hole in a predetermined direction, and the forming of resist layer includes forming the post opening such that the post opening has a center that is shifted from a center of the conductor pad in the predetermined direction.