Apparatus and method for providing a scalable ball grid array (bga) assignment and a pcb circuit trace breakout pattern for rf chip interfaces

An apparatus comprising:

• a pin map corresponding to a ball grid array and covering a surface area of a layer of a printed circuit board (PCB), the pin map comprising a plurality of electrical designations for each pin in the pin map and a plurality of empty spaces within the pin map;
• each electrical designation of the plurality of electrical designations comprising one of a positive polarity (P+), a negative polarity (P−), or an electrical ground (G);
• and
• the pin map including a first repeating pin polarity pattern;
• the first repeating pin polarity pattern comprising a lane unit tile, the lane unit tile having a central region defined by four pin map units, two of the four pin map units comprising two pins corresponding to a signal lane within the PCB.

An apparatus comprising:

• integrated circuit means for propagating high-speed communication signals stacked vertically relative to a layer of the printed circuit board (PCB), the integrated circuit means being coupled to the PCB with a ball grid array (BGA);
• a pin map corresponding to the BGA and covering a surface area of the PCB, the pin map comprising a plurality electrical designations for each pin in the pin map and a plurality of empty spaces within the pin map;
• each electrical designation of the plurality of electrical designations comprising one of a positive polarity (P+), a negative polarity (P−), or an electrical ground (G);
• the pin map including a first repeating pin polarity pattern;
• the first repeating pin polarity pattern comprising a lane unit tile, the lane unit tile having a central region defined by four pin map units, two of the four pin map units comprising two pins corresponding to a signal lane within the PCB.

A method comprising:

• selecting a first circuit element having a first ball grid array;
• determining if the first ball grid array comprises a narrow pitch;
• selecting a first pin map having a sparse repeating pin polarity pin pattern if the first ball grid array comprises a narrow pitch;
• selecting a second circuit element having a second ball grid array;
• determining if the second ball grid array comprises a narrow pitch;
• selecting a second pin map having a sparse repeating pin polarity pin pattern if the second ball grid array comprises a narrow pitch;
• identifying locations on a layer of a printed circuit board where circuit traces will connect pins of first pin map with pins of second pin map;
• placing pins on the layer of the printed board according to the selected first and second pin maps;
• and
• placing circuit traces on the layer of the printed circuit board according to the identified locations such that pins and circuit traces of the layer of the printed circuit board establish electrical connections between the first circuit element and the second circuit element, whereby crosstalk between circuit traces on the layer of the printed circuit board is substantially reduced.