Semiconductor Device Package Comprising a Thermal Interface Material with Improved Handling Properties
AssigneeInfineon Technologies Austria AG
InventorsMartin Mayer, Edward Fuergut, Alexander Roth, Karina Rott
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Abstract
A semiconductor device package comprises an electrically conductive carrier, a semiconductor die disposed on the carrier, an encapsulant encapsulating part of the carrier and the semiconductor die, an electrically insulating and thermally conductive interface structure, in particular covering an exposed surface portion of the carrier and a connected surface portion of the encapsulant, wherein the interface structure comprises a glass transition temperature in a range between −40° C. to 150° C.
Claims16
A semiconductor device package comprising:
- an electrically conductive carrier;
- a semiconductor die disposed on the carrier;
- an encapsulant encapsulating part of the carrier and the semiconductor die;
- an electrically insulating and thermally conductive interface structure, in particular covering an exposed surface portion of the carrier and a connected surface portion of the encapsulant;
- wherein the interface structure comprises a glass transition temperature in a range between −40° C. to 150° C.
A method of manufacturing a semiconductor device package, the method comprising:
- mounting a semiconductor die on an electrically conductive carrier,
- encapsulating part of the carrier and the semiconductor die by an encapsulant;
- forming an electrically insulating and thermally conductive interface structure, in particular to cover an exposed surface portion of the carrier and a connected surface portion of the encapsulant, the interface structure comprising a glass transition temperature in a range between −40° C. to 150° C.
Dependencies are inferred from the claim text.