Automotive power devices on direct bond copper embedded in pcb driver boards

A power device-embedded PCB comprising:

• a printed circuit board having a first major surface separated by a thickness and opposite a second major surface;
• and
• an embedded power device comprising:
• a power semiconductor device;
• an electrically and thermally conductive substrate bonded to the power semiconductor device along a first surface of the electrically and thermally conductive substrate and bonded to an electrical insulation layer on a second surface of the electrically and thermally conductive substrate opposite the first surface;
• and
• a plurality of vias extending from the electrical insulation layer to the second major surface of the printed circuit board whereby a bondable surface adjacent the second major surface of the printed circuit board is formed, wherein:
• the power semiconductor device, the electrically and thermally conductive substrate, the electrical insulation layer, and the plurality of vias are disposed within the printed circuit board between the first major surface and the second major surface.

A power device-embedded PCB comprising:

• a printed circuit board having a first major surface separated by a thickness and opposite a second major surface;
• and
• an embedded power device comprising:
• a power semiconductor device;
• and
• an electrically and thermally conductive substrate bonded to the power semiconductor device along a first surface of the electrically and thermally conductive substrate of the electrically and thermally conductive substrate and a second surface of the electrically and thermally conductive substrate opposite the first surface forms a bondable surface adjacent the second major surface of the printed circuit board, wherein the electrically and thermally conductive substrate includes a flange positioned along an edge extending from the first surface to the second surface, wherein:
• the power semiconductor device and the electrically and thermally conductive substrate are disposed within the printed circuit board between the first major surface and the second major surface;
• and
• one or more conductive power layers disposed within the printed circuit board between the first major surface and the first surface of the electrically and thermally conductive substrate and electrically coupled to the power semiconductor device along the first surface of the embedded power device.