Back to results
US 2022/0013428 A1Published application
Electronic device
AssigneeDenso Corporation
InventorsHiroyoshi KUNIEDA, Hiroki HAYASHI
Life of this patent
Estimating the term…
Abstract
An electronic device includes an upper package, a lower package and a printed circuit board. The upper package includes an upper chip. The lower package includes a lower chip. The upper package and the lower package are stacked on the printed circuit board. The thermal diffusion layer is disposed in a vicinity of the lower chip at the lower package.
Claims10
An electronic device comprising:
- an upper package including an upper chip;
- a lower package including a lower chip;
- a printed circuit board on which the upper package and the lower package are stacked;
- and
- a thermal diffusion layer disposed in a vicinity of the lower chip at the lower package,
- wherein the lower package includes an upper layer, an intermediate layer, and a lower layer,
- wherein the upper layer includes a plurality of wiring layers, and
- wherein the thermal diffusion layer is at least one of the wiring layers included in the upper layer.
5 more elements
Dependencies are inferred from the claim text.