Apparatus and Methods for Wafer to Wafer Bonding

A method comprising:

• having a model of a wafer bonding process, the model comprising an input indicative of a physical parameter of a first post-bond wafer and configured to output a wafer bonding recipe based on the physical parameter of the first post-bond wafer;
• bonding a first wafer to a second wafer in accordance with a wafer bonding recipe, to form the first post-bond wafer;
• obtaining measurements of the first post-bond wafer to obtain the physical parameter of the first post-bond wafer;
• generating, by the model, the first wafer bonding recipe in accordance with the physical parameter of the first post-bond wafer;
• and
• bonding a third wafer to a fourth wafer in accordance with the first wafer bonding recipe, to form a second post-bond wafer.

A processing system comprising:

• a non-transitory computer-readable storage medium comprising instructions that when executed cause a processor of a computing device to perform operations in coordination with a semiconductor wafer fabrication process, the instructions comprising:
• having a first wafer bonding recipe and a model of a wafer bonding process, the model comprising an input indicative of a physical parameter of a first wafer to be bonded to a second wafer and configured to output a wafer bonding recipe based on the physical parameter of the first wafer, the physical parameter of the first wafer representing information relating to topographical features of the first wafer;
• obtaining measurements of the first wafer to obtain the physical parameter of the first wafer;
• generating, by the model, the first wafer bonding recipe based on the physical parameter of the first wafer;
• and
• bonding the first wafer to the second wafer in accordance with the first wafer bonding recipe to produce a first post-bond wafer.