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US 2022/0013402 A1Published application
Stage device and substrate processing apparatus
AssigneeTokyo Electron Limited
InventorsMelvin VERBAAS, Einosuke TSUDA, Kentaro ASAKURA
Life of this patent
Estimating the term…
Abstract
A stage device includes: a stage having a pin hole provided therein and a placement surface on which a substrate is placed; and at least one lift pin configured to move up and down through the pin hole; and a lifter configured to raise and lower the at least one lift pin, wherein the stage includes a first heating part provided therein and configured to heat the stage, and the at least one lift pin includes a second heating part provided therein or therearound and configured to heat the at least one lift pin.
Claims11
A stage device comprising:
- a stage having a pin hole provided therein and a placement surface on which a substrate is placed;
- and
- at least one lift pin configured to move up and down through the pin hole;
- and
- a lifter configured to raise and lower the at least one lift pin,
- wherein the stage includes a first heating part provided therein and configured to heat the stage, and
- the at least one lift pin includes a second heating part provided therein or therearound and configured to heat the at least one lift pin.
4 more elements
A substrate processing apparatus, comprising:
- a processing container configured to process a substrate;
- a stage device;
- and
- a controller,
- wherein the stage device includes:
- a stage having a pin hole provided therein and a placement surface on which the substrate is placed;
- and
- a lift pin configured to move up and down in the pin hole while being inserted through the pin hole;
- and
- a lifter configured to raise and lower the lift pin,
- wherein the stage includes a first heating part provided therein and configured to heat the stage, and
- the lift pin includes a second heating part provided therein or therearound and configured to heat the lift pin, and
- the controller controls temperature adjustments performed by the first heating part and the second heating part.
10 more elements
Dependencies are inferred from the claim text.