Micro-led transfer method and display panel

A micro-light-emitting diode (micro-LED) transfer method, comprising:

• providing a donor substrate, the donor substrate comprising a bearing substrate and a plurality of LED grains arranged on the bearing substrate in an array;
• providing a pasting substrate, the pasting substrate comprising a bottom plate and a hot melt adhesive film arranged on the bottom plate;
• moving the pasting substrate to a position above the donor substrate, and moving the pasting substrate in a direction approaching the donor substrate to paste up the plurality of LED grains arranged on the bearing substrate by using the pasting substrate, so that the plurality of LED grains are separated from the bearing substrate;
• moving the pasting substrate pasted with the plurality of LED grains to a position above a target substrate in such a manner that the plurality of LED grains are closer to the target substrate than the pasting substrate, and conducting an alignment so that the plurality of LED grains are directly opposite to positions on the target substrate where the plurality of LED grains are to be arranged, respectively;
• and
• heating the pasting substrate pasted with the plurality of LED grains to a first temperature to melt the hot melt adhesive film, so that the plurality of LED grains are separated from the pasting substrate and then are transferred to the target substrate,
• the first temperature being greater than or equal to a melting temperature of the hot melt adhesive film.