Substrate processing system and temperature control method

A substrate processing system comprising:

• a substrate processing apparatus including
• a chamber,
• a substrate support disposed in the chamber, the substrate support including a base and an electrostatic chuck disposed on the base, the electrostatic chuck having a plurality of division regions each division region including a heater, and
• a temperature sensor disposed in the base, and configured to measure a temperature of a first division region among the plurality of division regions;
• and
• a controller including
• a measuring circuit configured to measure a resistance value of the heater for each of the division regions,
• an estimating circuit configured to estimate a temperature of each of the division regions based on the resistance value of the heater measured by the measuring circuit, and a relationship between resistance values of the heater and temperatures of the division region,
• a determining circuit configured to determine whether to correct the estimated temperature of each of the division regions based on the measured temperature and the estimated temperature of the first division region,
• a correcting circuit configured to, when the determining circuit determines to correct the estimated temperature of each of the division regions, correct the estimated temperature of each of the division regions based on the measured temperature and the estimated temperature of the first division region, and
• a power controller configured to, when the determining circuit determines to correct the estimated temperature of each of the division regions, control a power supplied to the heater for each of the division regions based on the temperature corrected by the correcting circuit, and when the determining circuit determines not to correct the estimated temperature of each of the division regions, control the power supplied to the heater for each of the division regions based on the temperature estimated by the estimating circuit.